{"id":1662,"date":"2020-01-23T09:37:40","date_gmt":"2020-01-23T08:37:40","guid":{"rendered":"https:\/\/www.alpha-numerics.solutions\/equipment-simulation\/"},"modified":"2025-03-06T10:04:56","modified_gmt":"2025-03-06T09:04:56","slug":"equipment-simulation","status":"publish","type":"page","link":"https:\/\/www.alpha-numerics.solutions\/en\/equipment-simulation\/","title":{"rendered":"Equipment simulation"},"content":{"rendered":"

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Keeping equipment cool<\/h1>\n

[\/et_pb_fullwidth_header][\/et_pb_section][et_pb_section fb_built=”1″ _builder_version=”4.16″ custom_padding=”80px||80px|||” global_colors_info=”{}”][et_pb_row _builder_version=”4.16″ custom_padding=”0px|||||” global_colors_info=”{}”][et_pb_column type=”4_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_text _builder_version=”4.27.4″ header_font=”|600|||||||” header_text_color=”#0c71c3″ header_line_height=”3em” header_2_text_color=”gcid-primary-color” custom_padding=”||0px|||” hover_enabled=”0″ global_colors_info=”{%22gcid-primary-color%22:%91%22header_2_text_color%22%93}” sticky_enabled=”0″]<\/p>\n

Stay cool<\/strong><\/h2>\n

Cooling electronic equipment and its parts and components presents system designers and hardware developers with ever increasing challenges. Because not only is power throughput continually rising, but packing density, too, is increasing, allowing systems less and less space for cooling and heat dissipation.<\/p>\n

It is therefore important to incorporate electronics cooling into the overall plan at an early stage in the design process.<\/p>\n

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Equipment level<\/b><\/h4>\n

Cooling from component to system level<\/strong><\/h2>\n

This begins with the simulation of the thermal behavior of individual components such as processors, chips, LEDs or IGBTs. Depending on output, design and the materials used, heat generation can vary here, too, and can play a vital role in the placement of components within the device.<\/p>\n

CelsiusEC <\/strong><\/em>imports all the details of your individual components from your CAD data and combines them with the available datasheet values and a comprehensive material library. Components can be modeled accurately thanks to intelligent parametric specification, allowing for a realistic simulation of the heat generated.<\/p>\n

This gives you the basis for an efficient thermal design \u2013 realistic and reliable.<\/p>\n

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Cooling entire systems<\/strong><\/h2>\n

Interaction between individual components, their configuration within the equipment and additional features such as housing material obviously also play a key role here. This also applies to the type of usage: because whereas stationary electronic equipment is usually exposed to only slight temperature fluctuations, devices such as smartphones etc. are sometimes left to lie in the direct sunlight and can thus overheat more easily.<\/p>\n

When simulating complete systems, CelsiusEC<\/strong>\u00a0also relies on your CAD data. The individual elements can be assigned different parameters, which results in a realistic model.<\/p>\n

In this way it is possible for 6SigmaET to produce simulations with detailed electronic equipment in a realistic environment with up to 750 million cells in acceptable computation times.<\/p>\n

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An overview of the options<\/strong><\/h2>\n

With CelsiusEC<\/strong><\/em> you get an easy-to-operate but reliable simulation tool for equipment-level cooling and thermal management.<\/p>\n

 <\/p>\n

    \n
  • \n

    Simple user interface<\/p>\n<\/li>\n

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    Access to MCAD and ECAD data such as STEP, Gerber, ODB++ and more<\/p>\n<\/li>\n

  • \n

    Comprehensive libraries for materials, fans and ECXML component access<\/p>\n<\/li>\n

  • \n

    Optimum integration \u2013 highly automated<\/p>\n<\/li>\n

  • \n

    Fast, stable solver (Windows, Linux, cluster-enabled)<\/p>\n<\/li>\n

  • \n

    Numerical and graphical results analysis, automated reporting and the ability to export data to be processed in Excel.<\/p>\n<\/li>\n<\/ul>\n

    [\/et_pb_text][\/et_pb_column][et_pb_column type=”1_2″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_image src=”https:\/\/www.alpha-numerics.solutions\/wp-content\/uploads\/2024\/10\/CelsiusEC-Visualisieren-der-Waermewege.png” title_text=”CelsiusEC – Visualize Thermal Paths” _builder_version=”4.27.2″ global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=”1″ fullwidth=”on” _builder_version=”4.16″ global_colors_info=”{}”][et_pb_fullwidth_slider _builder_version=”4.16″ min_height_tablet=”” min_height_phone=”” min_height_last_edited=”on|phone” global_colors_info=”{}” min_height__hover_enabled=”off|desktop”][et_pb_slide _builder_version=”4.16″ background_color=”#b3b3b3″ background_enable_color=”on” background_image=”https:\/\/www.alpha-numerics.solutions\/wp-content\/uploads\/2019\/12\/powerball-2.jpg” background_enable_image=”on” global_colors_info=”{}” sticky_transition=”on”]<\/p>\n

    Ball joint of the Schunk company.<\/strong><\/p>\n

    Detailed simulation of PCB heat losses (transmission losses & component outputs) and mechanical losses (brakes, motor)<\/p>\n

    [\/et_pb_slide][et_pb_slide _builder_version=”4.16″ background_color=”#b3b3b3″ background_enable_color=”on” background_image=”https:\/\/www.alpha-numerics.solutions\/wp-content\/uploads\/2019\/12\/6SigmaET-Themperatur-Simulation_db-audio-1.jpg” background_enable_image=”on” global_colors_info=”{}” sticky_transition=”on”]<\/p>\n

    Detailed CFD heat simulation of a concert amplifier with forced cooling and power components<\/p>\n

    [\/et_pb_slide][et_pb_slide _builder_version=”4.16″ background_color=”#b3b3b3″ background_enable_color=”on” background_image=”https:\/\/www.alpha-numerics.solutions\/wp-content\/uploads\/2019\/12\/kuehler.jpg” background_enable_image=”on” global_colors_info=”{}” sticky_transition=”on”]<\/p>\n

    Simulated cooling design for a heatpipe-based cooling unit including detailed electronics.<\/p>\n

    [\/et_pb_slide][et_pb_slide _builder_version=”4.16″ background_color=”#b3b3b3″ background_enable_color=”on” background_image=”https:\/\/www.alpha-numerics.solutions\/wp-content\/uploads\/2019\/12\/beleuchtungstechnik.jpg” background_enable_image=”on” global_colors_info=”{}” sticky_transition=”on”]<\/p>\n

    Simulation of indoor and outdoor LED lighting systems in realistic installation conditions<\/p>\n

    [\/et_pb_slide][et_pb_slide _builder_version=”4.16″ background_color=”#b3b3b3″ background_enable_color=”on” background_image=”https:\/\/www.alpha-numerics.solutions\/wp-content\/uploads\/2019\/12\/dockingstation.jpg” background_enable_image=”on” global_colors_info=”{}” sticky_transition=”on”]<\/p>\n

    Thermal simulation of a mobile phone docking station<\/p>\n

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    Contact Us<\/b><\/h4>\n

    If you\u2019d like to learn more about CelsiusEC<\/strong><\/em> and our services or request a trial license, don\u2019t hesitate to contact us.<\/p>\n

    [\/et_pb_text][et_pb_button button_url=”mailto:info@alpha-numerics.de?subject=information%20request%20%26%20contact” button_text=”Enquire now” _builder_version=”4.16″ global_colors_info=”{}”][\/et_pb_button][et_pb_button button_url=”@ET-DC@eyJkeW5hbWljIjp0cnVlLCJjb250ZW50IjoicG9zdF9saW5rX3VybF9wYWdlIiwic2V0dGluZ3MiOnsicG9zdF9pZCI6IjExOTAifX0=@” button_text=”Request trial license” _builder_version=”4.16″ _dynamic_attributes=”button_url” global_colors_info=”{}”][\/et_pb_button][et_pb_button button_url=”mailto:tobias.best@alpha-numerics.de?subject=Bitte%20kontaktieren%20Sie%20uns%20bzgl.%20einem%20Projektgespr%C3%A4ch” button_text=”Service request” _builder_version=”4.16″ global_colors_info=”{}”][\/et_pb_button][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=”1″ prev_background_color=”#ffffff” _builder_version=”4.27.4″ background_color=”gcid-f230f285-701a-4b85-8256-a7241ffc9527″ custom_padding=”40px||40px||true|false” top_divider_style=”arrow3″ global_colors_info=”{%22gcid-f230f285-701a-4b85-8256-a7241ffc9527%22:%91%22background_color%22%93}”][\/et_pb_section]<\/p>\n","protected":false},"excerpt":{"rendered":"

    Keeping equipment coolStay cool Cooling electronic equipment and its parts and components presents system designers and hardware developers with ever increasing challenges. Because not only is power throughput continually rising, but packing density, too, is increasing, allowing systems less and less space for cooling and heat dissipation. It is therefore important to incorporate electronics cooling […]<\/p>\n","protected":false},"author":2,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_et_pb_use_builder":"on","_et_pb_old_content":"","_et_gb_content_width":"","footnotes":""},"class_list":["post-1662","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/www.alpha-numerics.solutions\/en\/wp-json\/wp\/v2\/pages\/1662","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.alpha-numerics.solutions\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.alpha-numerics.solutions\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.alpha-numerics.solutions\/en\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.alpha-numerics.solutions\/en\/wp-json\/wp\/v2\/comments?post=1662"}],"version-history":[{"count":11,"href":"https:\/\/www.alpha-numerics.solutions\/en\/wp-json\/wp\/v2\/pages\/1662\/revisions"}],"predecessor-version":[{"id":4422,"href":"https:\/\/www.alpha-numerics.solutions\/en\/wp-json\/wp\/v2\/pages\/1662\/revisions\/4422"}],"wp:attachment":[{"href":"https:\/\/www.alpha-numerics.solutions\/en\/wp-json\/wp\/v2\/media?parent=1662"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}